Products in which both up and down circuit and connected via a through hole :
as a high density device mounting technology has been required, minimization of a via-hole and
high density integration has been accomplished

◎  Usage
general electronics and communication products and home appliances (a set top box, digital TV, car audio etc.)

◎ Specification
- two layers
- Thickness of board : 0.4 ~ 3.2mm
- Width/interval of Patterns : 100㎛  / 100㎛
- Smallest hole size: 0.20mm