To implement high density and minimization of products as electronics products have been high density and multi-functional, two different MLB products are twice laminated to from a blindvia on PCB

◎ Usage
portable and fixable electronic communication devices which are to be light weighted
(DMB, navigation etc.)

◎ Specification
up to two layers
Thickness of board : 0.8 ~ 2.4mm
Width/interval of Patterns : 100㎛  / 100㎛
Smallest hole size : 0.20mm